PLACEMENT OPTIMIZATION OF PRINTED CIRCUIT BOARDS IN THERMAL DESIGN OF HERMETICALLY SEALED UNIT
Annotation
The influence of placing of printed circuit boards on thermal conditions of stack package is considered. Peculiarities of heat removal in hermetically sealed unit are described. A method for optimizing the boards placing with due regard for differences between heat power dissipated by separate functional units is developed with the use of a CAE system for simulation of thermal conditions.
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