Journal
Scientific and technical journal of information technologies, mechanics and optics
UDK658.5
Issue:1 (59)
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THE INCREASING OF SOLDER JOINTS RELIABILITY UNDER THERMOMECHANICAL STRESS BY MEANS OF UNDERFILLING BALL GRID ARRAY OF BGA PACKAGES
Annotation
The encapsulation process (underfilling) was examined, that traditionally has been used as a part of Flip Chip assembly process. It is proposed to use underfilling for long-term protection of BGA devices in harsh operating environments. Specific guidelines were defined to ensure stability and quality of the encapsu-lation of large BGAs. In addition, this paper includes experimental data on thermal cycling for protected and nonprotected BGA samples.
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